Competition in the contract manufacture of chips makes manufacturers actively introduce advanced technological processes. So, TSMC boosts development of technology 16 nm FinFET +, while Samsung is interested in promoting processes of 14 nm LPP.
TSMC is ready to start mass production of 16-nm technology by the end of this year. Characteristically, the company expects that customers will prefer a more advanced process 16 nm FinFET +, although some projects initially will still be made in accordance with 16 nm FinFET.
Samsung is going to soon begin mass production using the 14 nm process LPE (low power early), which will later will be replaced by a 14 nm LPP (low power plus). The latter provides better performance and energy efficiency schemes.